自動化系統
★ 4DM 1910TT
Tray Based Scanner for Packaged IC
詳細介紹
Tray Based Scanner for Packaged IC

◆Leads : TSOP , QFP

Pards : QFN , BCC
Balls : BGA , CSP , WLP
Lands : LGA
PoP : Interconnect


★ Technical Data

◇Packsge Types : TSOP , QFP , BGA , CSP , LGA , PoP , QFN , BBC etc
Package size : 3x3mm to 45x45mm
Scanner Type : Tray or Tape & Reel
Inspection Function : True 3D , 2D , PVI , Mark , etc
Power supply : 220V
Power consumption : max . 40A
Inert gas supply : Air ( 0.5Mpa )
Dimensions ( W x D x H ) : 1.150 x 1.000 x 1.850 mm
Weight approx : 500 kg

★ THE 2D MODULE
HIGH – RESOLUTION AND CAPABILTY
LARGE FOV WITH INCREASED HOMOGENEITY
SPECIAL LIGHT SOURCE FOR 2D INSPECTION
EASY ADJUST AND CALIBRATION
EASY UPGRADE CCD AND LIGHT SOURCE

★ THE 3D MODULE
BEST ACCURACY AND SPEED
3D INSPECTION OF ANY OBJECT : BALLS , LEADS , SOLDER PADS , ETC
3D SCAN OF SURFACES TO DETECT AND MEASURE DENTS , ETC
MULTIROW INSPECTION FOR DEVICES
ACCURATE COMPONENT HEIGHT MEASUREMENT

★ Software
Inspection System , Motion System , Report System , Mapping System , SECS/GEM , etc