Tray Based Scanner for Packaged IC
◆Leads : TSOP , QFP
◆Pards : QFN , BCC
◆Balls : BGA , CSP , WLP
◆Lands : LGA
◆PoP : Interconnect
★ Technical Data
◇Packsge Types : TSOP , QFP , BGA , CSP , LGA , PoP , QFN , BBC etc
◇Package size : 3x3mm to 45x45mm
◇Scanner Type : Tray or Tape & Reel
◇Inspection Function : True 3D , 2D , PVI , Mark , etc
◇Power supply : 220V
◇Power consumption : max . 40A
◇Inert gas supply : Air ( 0.5Mpa )
◇Dimensions ( W x D x H ) : 1.150 x 1.000 x 1.850 mm
◇Weight approx : 500 kg
★ THE 2D MODULE
◇HIGH – RESOLUTION AND CAPABILTY
◇LARGE FOV WITH INCREASED HOMOGENEITY
◇SPECIAL LIGHT SOURCE FOR 2D INSPECTION
◇EASY ADJUST AND CALIBRATION
◇EASY UPGRADE CCD AND LIGHT SOURCE
★ THE 3D MODULE
◇BEST ACCURACY AND SPEED
◇3D INSPECTION OF ANY OBJECT : BALLS , LEADS , SOLDER PADS , ETC
◇3D SCAN OF SURFACES TO DETECT AND MEASURE DENTS , ETC
◇MULTIROW INSPECTION FOR DEVICES
◇ACCURATE COMPONENT HEIGHT MEASUREMENT
★ Software
◇Inspection System , Motion System , Report System , Mapping System , SECS/GEM , etc
◆Leads : TSOP , QFP
◆Pards : QFN , BCC
◆Balls : BGA , CSP , WLP
◆Lands : LGA
◆PoP : Interconnect
★ Technical Data
◇Packsge Types : TSOP , QFP , BGA , CSP , LGA , PoP , QFN , BBC etc
◇Package size : 3x3mm to 45x45mm
◇Scanner Type : Tray or Tape & Reel
◇Inspection Function : True 3D , 2D , PVI , Mark , etc
◇Power supply : 220V
◇Power consumption : max . 40A
◇Inert gas supply : Air ( 0.5Mpa )
◇Dimensions ( W x D x H ) : 1.150 x 1.000 x 1.850 mm
◇Weight approx : 500 kg
★ THE 2D MODULE
◇HIGH – RESOLUTION AND CAPABILTY
◇LARGE FOV WITH INCREASED HOMOGENEITY
◇SPECIAL LIGHT SOURCE FOR 2D INSPECTION
◇EASY ADJUST AND CALIBRATION
◇EASY UPGRADE CCD AND LIGHT SOURCE
★ THE 3D MODULE
◇BEST ACCURACY AND SPEED
◇3D INSPECTION OF ANY OBJECT : BALLS , LEADS , SOLDER PADS , ETC
◇3D SCAN OF SURFACES TO DETECT AND MEASURE DENTS , ETC
◇MULTIROW INSPECTION FOR DEVICES
◇ACCURATE COMPONENT HEIGHT MEASUREMENT
★ Software
◇Inspection System , Motion System , Report System , Mapping System , SECS/GEM , etc